A small footprint with GPU capabilities. Completely and easily configurable, the RE1739 boasts advanced thermal management in a composite chassis for rugged compute performance. This embedded computer system has a modular chassis that accommodates multiple micro-ATX motherboard/processor configurations, while following leading-edge CPU and GPU roadmaps to ensure access to the latest, most powerful silicon chipsets and processors. The integrated DC power supply is designed for low voltage noisy vehicular applications.
RE1739 Features
- Modular chassis accommodates multiple micro-ATX motherboard/processor configurations
- Multiple DC input options and 120- 240VAC
- Up to six 7 or 9mm SSD storage options, including removable drives
- Supports full-height, full-length cards; GPU ready
- IPMI intelligent management
Mechanical
| Height | 6.1" (15.3cm) |
| Width | 16.3" (41.4cm) |
| Depth | 13" (33cm) |
| Weight | 18-30lbs (8.2-13.6 kg) |
| Power | 75-650W with select configurations; CPU/GPU dependent |
CPU Architecture
| Modular chassis accommodates multiple micro-ATX motherboard/processor configurations |
Internal Bay
| Six SATA/SAS 2.5” SSD (externally removable) |
Cooling
| Three high-reliability, 120mm fans; back to front airflow |
Power Supply
| Option 1: | 10-36VDC |
| Option 2: | 18-36VDC |
| Option 3: | 120-240VAC 50/60Hz, 115VAC 400Hz |
Mounting
| Option 1: | Tray |
| Option 2: | Bulkhead; ears supplied |
| Option 3: | Rack |
Environmental Standards
| Testing in Progress | |
| MIL-STD-810, Operational Temperature | -40°C to +60°C |
| MIL-STD-810, Storage, Method 501, Procedure I/II | -40°C to +85°C |
| MIL-STD-810, Humidity, Method 501, Procedure II | 240 hours with humidity kit |
| MIL-STD-810, Humidity, Method 507, Procedure II | 12,500ft operation, 40,000ft transport |
| MIL-STD-810, Vibration, Method 514, Procedure I | 5.5G, 5-2,000Hz, 60 min/ axis, 3 axis with vibration kit |
Electromagnetic Compatibility Standards
| MIL-STD-461, CE102, RE102 with kit |