Field tested, failsafe and long life performance in extreme conditions. Feature rich Crystal Group Embedded Computer Systems are powerful, compact, and rugged. Completely and easily configurable, the Embedded product line boasts advanced thermal management and an all-aluminum chassis, are field-tested to withstand shock and vibration, extended temperature ranges, harsh elements and harsh environments. Crystal Group embedded computer systems follow the Intel® embedded roadmap to ensure access to the latest in long life, powerful Intel chipsets and processors.
RE1012 Rugged Embedded Computer
- Compact construction – 2.4”H x 16” x 11” footprint
- Panel or rack mounting options
- Six Intel® Xeon® D-1528 CPU
- Dual 2.5″ SSD hard drives
- Billet construction from milled and strain hardened 6061-T6511 structural aircraft aluminum
- IEEE 1613 and IEC 61850-3 certification ready
- Fanless, no moving parts, high reliability
Environmental Standards
| MIL-STD-461 | -40°C to +40°C |
| MIL-STD-810, Storage, Method 501, Procedure I/II | -40°C to +85°C |
| MIL-STD-810, Humidity, Method 507, Procedure II | 240 hours with humidity kit |
| MIL-STD-810, Altitude, Method 500 | 12,500ft operation, 40,000ft transport |
| MIL-STD-810, Vibration, Method 514, Procedure I | 5.5G, 10-2000Hz, 60 min/axis, 3 axes |
| MIL-STD-810, Shock, Method 516, Procedures I/V | 20g, 11msec– functional shock; 40g 11msec crash hazard shock |
| MIL-S-901, Grade B | |
| MIL-S-901, Grade A | With solid state drives + shock kits |
Electromagnetic Compatibility Standards
| Some standards may require an internal kit | |
| IEC 61850-3 | International Standard Communication Networks and Systems for Power Utility Automation (covers environment and EMC concerns) |
| IEEE 1613 | Standard Environmental and Testing Requirements for Communications Networking Devices in Electric Power Substations |
| Emissions | radiated FCC Part 15. 109, Class A; conducted FCC Part 15. 107, Class A |
| Testing with solid state drives | |
Mechanical
| Form Factor | 1U |
| Height | 2.4" (6.1cm) |
| Width | 16" (40.64cm) |
| Depth | 11" (27.94cm) |
| Weight | 7.52 lbs (3.41 kgs) |
| Power | 55-80W with select configurations, CPU dependent |
Expansion Slots
| One PCIe X16 low profile |
Internal Expansion Slots
| Two SATA 2.5” SSD (not externally removable), one M.2 internal SSD |
Cooling
| Fanless; passively cooled through heatpipe technology with no moving components |
Mounting
| Panel mounting via ears on base | |
| 19” rack mount kit |
Power Supply
| Option 1 | 90-250 VAC 50/60 Hz with locking power cord |
| Option 2 | 18-36 VDC |
| Option 3 | 48 VDC |
| Option 4 | 130 VDC |
System Board
| X10SDV-6C-TLN4F, Xeon D-1528 CPU, Up to 128 GB ECC DDR4, 2-USB 2.0, 2-GBLAN, IPMI, VGA, 1-PCIe x16 (Note, these features are at the board level and may not all be available in the standard configuration) |
Software Capability
| Accepts Windows 10®, RHEL® or VMware 6® |
Export Compliance
| ECCN: 5A992 | Classification is dependent on configuration and is subject to change. Please contact your Program Manager to receive the classification of your product. |