Crystal Group FG2 1100 Series: 1U servers

Transform the tactical edge with real-time processing. The Crystal Group FG2 1100 Series servers provide enhanced storage and CPU options based on specific application needs. Intel’s® 4th Generation Xeon® Scalable processors have built-in artificial intelligence (AI) acceleration with Intel® Deep Learning Boost, advanced encryption standard (AES), total memory encryption, software guard extensions (SGX), support a single-socket E+ motherboard, and increase system memory bandwidth with up to eight 4800MHz DDR5 channels. The EPYC 9004 series platform with AMD 3D V-Cache™ features up to 24 cores, 48 threads and 160 PCIe Gen5 lanes in a single-socket board. This resource-saving architecture boasts up to 4TB of DDR5 ECC RDIMM, delivering the highest performance available for compute- and memory-intensive workloads while lowering power consumption.

This NVIDIA-Certified System is validated for optimal performance, manageability, security and scalability.

Use Cases:

  • Battlespace management and visualization
  • C4/ISR processing
  • High-density computing in air, on land or at sea
  • Sensor fusion for pinpoint situational awareness
  • Cryptographic engines
  • Inference at scale at the tactical edge
  • Security applications requiring tamper resistance and instant data destruction
  • GPU server
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Crystal Group FG2 1100 Series: 1U servers
  • Single processor
  • Up to 24 cores
  • Low-profile or full-height PCIe
  • Modular design
  • AC or DC power
  • Up to 4 TB DDR5 ECC RDIMM

Click here to view all Crystal Group FORCE Module Options.

Mechanical
Form Factor 1U
Height 1.75” (4.45 cm)
Depth 19” (48.3 cm)
Width 16.9” (44.5 cm)
Weight 23–26 lbs (10.4-11.8 kg)
Mounting
Glides, fixed mount (front and rear), or Jonathan rails
Power Supply
800WAC, 50/60 or 400Hz, 505W 18–36VDC
CPU Architecture
4th Generation Intel Xeon Scalable or AMD EPYC 9004 series processors
CPU Power: up to 165W per socket
Memory
16GB–4TB DDR5 ECC RDIMM (motherboard dependent)
Expansion Slots
One low-profile or full-height PCIe slot (motherboard dependent)
External Bays
Option 1 Up to 8 SATA or SAS SSDs
Option 2 Up to 4 U.2/U.3 NVME SSDs
Software Compatibility
Windows 11, Windows 10, Windows Server, VMware, Linux
Environmental Standards
MIL-STD-810, Operational Temperature, high Procedure II: +55°C, two-hour dwell, four cycles
MIL-STD-810, Operational Temperature, low Procedure II: -40°C, two-hour dwell, four cycles
MIL-STD-810, Altitude, Method 500 12,500 ft. operation, 40,000 ft. transport
MIL-STD-810, Thermal Shock, Method 503 Procedure II: 10 cycles, -40°C to +55°C, 15-min dwell, <1-min transfer time
MIL-STD-810, Humidity, Method 507 Procedure II: 240 hours with optional conformal coating kit
MIL-STD-810, Fungus, Method 508 28 days, mixed spore, 30°C 95% RH
MIL-STD-810, Salt fog, Method 509 48-hour test
MIL-STD-810, Sand-Dust, Method 510 Procedure I: Blasting dust, 12 hours
MIL-STD-810, Acceleration, Method 513 Procedure II: 9g
MIL-STD-810, Vibration, Method 514 Procedure I: 4.7G, 5–2,000Hz, 60 min/axis, 3 axis
MIL-STD-810, Shock, Method 516 Procedures I & V: 40G, 11ms, 18 pulses, 3/axis both directions
MIL-STD-1474E, Acoustic Noise Requirement S, Grade A3
MIL-STD-167-1A, Ship Vibration Type 1
MIL-S-901E, Shipboard Shock Class II, A/B
Electromagnetic Compatibility Standards
MIL-STD-461 EMI/EMC, RE102, CE102; surface ship, below deck, and ground
RTCA/DO-160 Aircraft and airborne equipment, Category M
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