Crystal Group FG2 2600 Series: 2U servers

Take real-time AI & ML from the data center to the edge. Equipped with up to four state-of-the-art GPUs and two Intel® Xeon® Scalable or AMD EPYC™ processors in an unmatched rugged design, the FG2 2600 Series servers deliver exceptional reliability and Tensor Core performance at the tactical edge. Up to eight NVMe or sixteen SATA/SAS drives can be configured for CSfC data storage for applications requiring FIPS 140-2 certification. Designed to handle challenging, yet critical inference obstacles, the extreme, scalable compute power of the FG2 2600 Series brings ultra-low latency and seamless operation to the most volatile, mission-critical conditions when real-time situational awareness and AI can’t be compromised. InfiniBand I/O connectivity provides critical, rapid data transfer for low-latency backhaul applications.

This NVIDIA-Certified System is validated for optimal performance, manageability, security and scalability.

Use Cases:

  • Battlespace management awareness
  • Command and control communications
  • Intelligence gathering and processing
  • Data storage server
  • Sensor fusion for air and ground vehicles
  • Leader-follower autonomous vehicles
  • GPU server
  • Virtualization platform
Crystal Group FG2 2600 Series: 2U servers
  • Single or dual processors
  • 48 cores
  • Up to 6 low-profile PCIe slots
  • 2 M.2
  • 8 NVMe
  • 16 SATA
  • AC or DC power
  • Up to 4TB DDR5 ECC RDIMM
  • Modular design

Click here to view all Crystal Group FORCE Module Options.

Mechanical
Form Factor 2U
Height 3.5” (8.89 cm)
Depth 19” (48.3 cm) or 22” (58.88 cm)
Width 17.5” (44.45 cm)
Weight 32–38 lbs (14.51–17.23 kg)
Mounting
Glides, fixed mount (front and rear), or Jonathan rails
Power Supply
800WAC, 1005W 18–36VDC, or 1200W AC 1+1
CPU Architecture
4th Generation Intel Xeon Scalable or AMD EPYC 9004 series processors
Up to 96 cores per socket (motherboard dependent)
Memory
16GB–4TB DDR5 ECC SDRAM (motherboard dependent)
Expansion
Up to six low-profile PCIe slot
I/O
Commercial I/O or optional MIL-CIRC connector I/O
External Bays
Up to 16 SATA or SAS SSDs
Up to 8 U.2/U.3 NVME SSDs
Optional optical drive
Software Compatibility
Windows 10, Windows 11, Windows Server, VMware, Linux
Environmental Standards
MIL-STD-810, Operational Temperature, high Procedure II: +50°C, two-hour dwell, four cycles
MIL-STD-810, Operational Temperature, low Procedure II: -30°C, two-hour dwell, four cycles
MIL-STD-810, Altitude, Method 500 12,500 ft. operation, 40,000 ft. transport
MIL-STD-810, Thermal Shock, Method 503 Procedure II: 10 cycles, -40°C to +55°C, 15-min dwell, <1-min transfer time
MIL-STD-810, Humidity, Method 507 Procedure II: 240 hours with optional conformal coating kit
MIL-STD-810, Fungus, Method 508 28 days, mixed spore, 30°C 95% RH
MIL-STD-810, Salt fog, Method 509 48-hour test
MIL-STD-810, Sand-Dust, Method 510 Procedure I: Blasting dust, 12 hours
MIL-STD-810, Acceleration, Method 513 Procedure II: 9g
MIL-STD-810, Vibration, Method 514 Procedure I: 4.7G, 5–2,000Hz, 60 min/axis, 3 axis
MIL-STD-810, Shock, Method 516 Procedures I & V: 40G, 11ms, 18 pulses, 3/axis both directions
MIL-STD-1474E, Acoustic Noise Requirement S, Grade A3
MIL-STD-167-1A, Ship Vibration Type 1
MIL-S-901E, Shipboard Shock Class II, A/B
Electromagnetic Compatibility Standards
MIL-STD-461 EMI/EMC, RE102, CE102; surface ship, below deck, and ground
RTCA/DO-160 Aircraft and airborne equipment, Category M
Download Spec Sheet