Crystal Group FG2 3700 Series: 3U servers

Achieve an information superiority at the speed of relevance. Designed with up to four of the world’s highest-performing GPUs and either Intel® Xeon® Scalable or AMD EPYC™ processors with the latest PCIe Gen5 interconnectivity, the Crystal Group FG2 3700 Series servers deliver unmatched acceleration for data processing, machine learning, AI training, and AI inference. The scalable configuration can also accommodate ultra-fast DPUs. Pairing GPUs with DPUs enables enhanced data and application security, increased data center and cloud application performance, and ultra-low latency networking at the edge.

The compact, rugged design integrates high-capacity, long-life, custom power supplies, and custom heat sinks for optimal thermal performance. This ensures reliable, seamless execution of mission-critical applications—from real-time sensor fusion and object recognition to video processing and ray tracing—delivering complete, accurate, actionable intelligence.

This NVIDIA-Certified System is validated for optimal performance, manageability, security and scalability.

Use cases:

  • Tactical battlespace management
  • Command and control networking
  • Intelligence gathering and data processing
  • Multi-sensor fusion aggregation
  • Data storage server (NVMe, SAS, or SATA)
  • GPU server
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Crystal Group FG2 3700 Series: 3U servers
  • Single or dual processors
  • 64 cores
  • 7 PCIe
  • 2 M.2
  • 12 NVMe
  • 24 SATA
  • AC or DC power
  • 4TB DDR4
  • Modular design

Click here to view all Crystal Group FORCE Module Options.

Mechanical
Form Factor 3U
Height 5.25” (13.33 cm)
Depth 19” (48.3 cm) or 22” (58.88 cm)
Width 17.5” (44.45 cm)
Weight 38–42 lbs (17.23–19.05 kg) or 40–62 lbs (18.14–28.12 kg)
Mounting
Glides, fixed mount (front and rear), or Jonathan rails
Power Supply
800WAC, 1005W 18–36VDC, or 1200W AC 1+1
CPU Architecture
4th Generation Intel Xeon Scalable or AMC EPYC 9004 series processors
Up to 96 cores per socket (motherboard dependent)
Memory
16GB–4TB DDR5 ECC SD RAM (motherboard dependent)
Expansion
Up to seven full-height PCIe slots
External Bays
Up to 24 SATA or SAS SSDs
Up to 12 U.2/U.3 NVMe SSDs
Software Compatibility
Windows 10, Windows 11, Windows Server, VMware, Linux
Environmental Standards
MIL-STD-810, Operational Temperature, high Procedure II: +50°C, two-hour dwell, four cycles
MIL-STD-810, Operational Temperature, low Procedure II: -30°C, two-hour dwell, four cycles
MIL-STD-810, Altitude, Method 500 12,500 ft. operation, 40,000 ft. transport
MIL-STD-810, Thermal Shock, Method 503 Procedure II: 10 cycles, -40°C to +55°C, 15-min dwell, <1-min transfer time
MIL-STD-810, Humidity, Method 507 Procedure II: 240 hours with optional conformal coating kit
MIL-STD-810, Fungus, Method 508 28 days, mixed spore, 30°C 95% RH
MIL-STD-810, Salt fog, Method 509 48-hour test
MIL-STD-810, Sand-Dust, Method 510 Procedure I: Blasting dust, 12 hours
MIL-STD-810, Acceleration, Method 513 Procedure II: 9g
MIL-STD-810, Vibration, Method 514 Procedure I: 4.7G, 5–2,000Hz, 60 min/axis, 3 axis
MIL-STD-810, Shock, Method 516 Procedures I & V: 40G, 11ms, 18 pulses, 3/axis both directions
MIL-STD-1474E, Acoustic Noise Requirement S, Grade A3
MIL-STD-167-1A, Ship Vibration Type 1
MIL-S-901E, Shipboard Shock Class II, A/B
Electromagnetic Compatibility Standards
MIL-STD-461 EMI/EMC, RE102, CE102; surface ship, below deck, and ground
RTCA/DO-160 Aircraft and airborne equipment, Category M
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